VP9000Solder paste inspection machine
User-friendly GUI |
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User-friendly GUI |
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-Visualization of Solder Paste Shift -High Resolution -Improved Operability -Visualization of Operational Status -Super High Resolution -Foreign Material Inspection -Glue Inspection (Optional) Foreign materials can be effortlessly Precise amounts of dispensed glue detected while inspecting solder paste can be measured,n 3D for judgement
| -PCB Warp Distribution Display -Upgraded Manual Verification Function Warpage amounts can be measured, Operators have the option to reconsider visualized and saved for future reference. the reasons for defective judgements
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VP9000(Standard) | VP9000(High-Speed) | |
Inspection Method | Phase Shift Method | |
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PCB Size | (M)50mm X 50mm to 330mm X 250mm (L)50mm X 50mm to 510mm X 460mm |
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PCB Thickness | 0.3 to 5.0mm | |
Projection | Dual Projectors | Single Projector |
Inspection Resolution | [ Standard / High / Super-High ] (1)[25 µ m/12.5 µ m/8.5 µ m], (2)[20 µ m/10 µ m/5 µ m], (3)[15 µ m/7.5 µ m/5 µ m] |
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Speed (mm2/sec) |
______________ __(1)__ __(2)__ __(3)__ Standard : 8,900 5,700 3,200 High : 5,600 3,500 1,900 SuperHigh : 1,900 1,200 650 |
______________ __(1)__ __(2)__ __(3)__ Standard : 9,400 6,000 3,300 High : 6,000 3,700 2,000 SuperHigh : 2,000 1,300 700 |
Accuracy (volume3δ*1) |
Within 2% | Within 3% |
PCB Warping Compensation |
±5mm | |
Outline Dimensions |
(M)724 X 970 X 1,500mm (L)904 X 1,180 X 1,600mm |
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Power Supply | Single Phase AC200-230V 50-60Hz MAX 1 KVA | |
Pneumatic Supply |
Not Required | |
Weight | (M) 460kg (L) 550kg |
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UPS | Standard Equipment (only PC) | |
Environmental Standard |
RoHS | |
Optional |
Data Station (connect up to 6 sets of machines), Transformer, 1D & 2D Code Reading, Glue Inspection, ePM-SPI Software, Loading Conveyor, Unloading Conveyor, Mount Data Conversion Software, Keyboard Tray, CE Compliance (Large machines only), Ultrafine Resolution (10, 8, 5μm), Feedback/Feedforward |
*1 When CKD sample board is used